Mobile DRAM is also a 'stacking' war...Samsung, SK Hynix enter second round of H

Mobile DRAM is also a 'stacking' war...Samsung, SK Hynix enter second round of HBM

- Samsung Electronics and SK Hynix are competing in the field of LPDDR DRAM as well as High Bandwidth Memory (HBM).

- LPDDR DRAM is characterized by low power, and it is attracting attention as a new 'food' due to its increased utilization in the AI market.

- Samsung Electronics is developing a VCS DRAM with the goal of mass production in 2026. It is a product of four layers of LPDDR DRAM.

- SK Hynix is developing a similar product under the name of 'VFO' and unveiled the related technology at ECTC 2024.

- These technologies are characterized by LPDDR DRAM stacking directly on top of the AP to improve app execution speed and AI implementation speed.

- As the AI PC adoption rate increases, the demand for LPDDR DRAM is expected to increase. By 2027, the AI PC adoption rate is expected to rise to 63%.

- LPDDR DRAM utilization is also increasing in the server market due to power efficiency issues. LPDDR DRAM is applied to Nvidia's Grace CPU and Samsung Electronics' Maha AI chip.

- Market research firm Omdia predicts that the LPDDR DRAM market will grow from USD 12.34 billion in 2023 to USD 25.5 billion in 2027.

- LPDDR DRAM has the disadvantage of being less safe than server memory, but it is also applied to servers as power efficiency becomes important.

- These technological advances and market changes can be seen as a result of the development of AI technology and the increasing demand for power efficiency.

#Memory #DRAM #LPDDR #AI