Hybrid bonding, which was applied to system

●Hybrid bonding, which was applied to system semiconductors, is in the process of expanding its application to HBM and 3D NAND. Where does the flow of expanding the application of hybrid bonding to system semiconductors and memory semiconductors come from? What are the equipment that becomes technically important for applying hybrid bonding? There will be equipment that increases the technical difficulty, and there will be equipment that is newly introduced, so if you explain it separately?

[The background of expanding the application of hybrid bonding]

1. Performance needs

• Advances in AI, 5G, and IoT technologies have increased the demand for high-performance, low-power semiconductors.

• Hybrid bonding meets these needs by increasing signal transfer efficiency and reducing power loss.

2. Need for miniaturization and high integration

• Chip miniaturization has become important in mobile devices and wearable devices.

• Hybrid bonding enables ultra-dense interconnects to achieve 3D chip stacking.

3. Overcoming technical limitations

• The transition of DRAM structure to 3D has increased the importance of hybrid bonding.

• Hybrid bonding is essential in the manufacture of NAND flash over 400 stages.

[Existing equipment is becoming more difficult]

1. CMP(Chemical Mechanical Polishing) 장비

• It is used to flatten the surface of the die and wafer.

• Hybrid bonding requires more precise flattening.

2. Laser Dicing Equipment

• It is used to cut dies and wafers.

• Hybrid bonding requires more sophisticated laser dicing; introduction of laser full-cut equipment may be considered.

3. Plasma treatment equipment

• It is used for surface activation and bonding strengthening.

• Hybrid bonding requires more sophisticated plasma control.

[New equipment is being introduced]

1. Hybrid Bonder

• Equipment that accurately attaches heterogeneous chip dies on wafers.

• BESI of the Netherlands is currently the only production company, and companies such as Hanmi Semiconductor are currently developing it.

2. Precision alignment equipment

• It is necessary to align copper and dielectric accurately.

• Nanometer-level precision is required.

3. heat treatment equipment

• It is used in the annealing process to complete copper-copper bonding.

• Accurate temperature control and uniform heat distribution are important.

*The introduction of hybrid bonding technology is bringing about major changes in the semiconductor industry. The technology plays a key role in meeting the requirements of modern semiconductors such as high performance, low power, and miniaturization. However, due to the high technical difficulty and cost, it is difficult to introduce, which requires close cooperation between semiconductor manufacturers and equipment manufacturers to overcome.